Dalian, China Sep.8, 2022
Dalian Dalicap Technology Co., Ltd., one of the world's leading suppliers of RF/Microwave ceramic capacitors, officially released two new products of thin-film circuits and thick-film hybrid circuits in recent days.
Dalicap’s thin film circuit adopts magnetron sputtering, photolithography, dry and wet etching, gold plating and other processes to form high-precision circuit patterns and thin-film components on ceramic substrates, and finally have specific circuit functions.
Based on its excellent high frequency performance and high reliability, it is suitable for various microwave/millimeter wave application scenarios and high-speed optical communication devices.
Dalicap’s thick film hybrid circuit uses thick film technology to make components on the substrate, sputtering titanium and copper, DPC (direct plating copper), and then carry out surface treatment, and finally becomes a ceramic substrate with specific circuit functions.
Based on the DPC process, the thickness of the copper layer is increased so that the circuit can withstand higher power, and it is widely used in the fields of consumer electronics and industrial electronics.
With the release of new products of thin film circuit and thick film hybrid circuit, Dalicap will also usher in new development opportunities and provide more services to customers around the world.
For more information, please go to the product center.
